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Main Applications

Smart Cockpit and In-vehicle Entertainment Interconnectivity

Providing miniaturized Wafer connectors and FPC connector solutions for the connection requirements of automotive intelligent cockpit systems, in-vehicle infotainment head units, instrument cluster displays, and HUD head-up displays and other modules. Meeting the automotive quality requirements of high-density wiring, limited space, and reliable durability.

Smart cockpit in-car entertainment instrument cluster display HUD air conditioning control steering wheel control

Features

Key Advantages

Miniaturized 2.0/1.5mm pitch Wafer

Locking buckle anti-loosening design

Temperature resistance: -40°C to +105°C

Passed ELV/RoHS certification

Anti-vibration conforms to JASO D616

Miniaturized wafer high-density wiring

Overview

In-depth Product Details & Applications

Solution Overview

As smart cockpits become increasingly integrated, internal connectors are required to be miniaturized, multifunctional, and highly reliable. This solution is based primarily on Wafer connectors, providing compact and reliable wire-to-board connection solutions for in-vehicle infotainment systems, instrument clusters, and air conditioning control panels.

Main Application Areas

Infotainment head unit: display drive connections, touchpad FPC, Wi-Fi/BT antenna, USB interface module
Instrument cluster assembly: LCD instrument display drive, indicator light PCB connection, multifunction steering wheel controls
HUD head-up display: image generation unit PGU connection, projection light source drive, ambient light sensor
Air conditioning controller: panel button connections, electric air door actuator, temperature sensor, blower speed control

Solution Advantages

The locking Wafer ensures that the connector does not come loose under vibration environments; multiple pin count specifications (2P-16P) adapt to different functional modules; supports automated crimping and assembly, reducing wire harness manufacturing costs.