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Main Applications

5G Base Station Modular Interconnection

Provide BTB board-to-board connector solutions for the high-speed data and RF signal connections among the RF processing unit, baseband processing unit, and antenna filter unit in 5G base station equipment. The 0.4mm-0.5mm fine pitch meets high-density interconnection requirements, and excellent SI performance ensures 5G high-frequency signal integrity.

5G base station RF module baseband unit antenna system small cell

Features

Key Advantages

0.4mm fine-pitch high-density

Stacking height 1.0-3.0mm

20-100Pin flexible selection

Low insertion loss

Wide temperature range -40°C to +125°C

Meets the requirements for 5G high-frequency signal transmission

Overview

In-depth Product Details & Applications

Solution Overview

The interior of 5G base station equipment is divided into multiple functional modules (RF, baseband BB, power PA, etc.), and high-density, high-speed interconnect channels are required between modules. This solution adopts high-performance BTB connectors, precise impedance control, and signal shielding design to meet the signal transmission requirements of 5G NR millimeter-wave and Sub-6GHz bands.

Main Application Areas

RF Processing Unit: RF transceiver and front-end module connection, power amplifier PA control
Baseband Processing Unit: FPGA/DSP and accelerator card interconnection, fronthaul interface CPRI/eCPRI connection
Antenna System: Beamforming control board connection, phase shifter control, antenna calibration interface
Small Base Station/Micro Base Station: Core board and RF board interconnection, backhaul interface, power management module

Solution Advantages

Precise control of differential impedance 100Ω±10%; crosstalk <-30dB@10GHz; guide posts assist self-alignment to improve placement yield; dual-contact terminal redundant design ensures long-term reliability.